【Xiamen Lianxin Integrated Circuit Project】Rubber Joint Case
Shanghai Songjiang Shock Absorber Group Limited produces various rubber joint products. On June 16, 2015, we provided supporting Songjiang rubber joint products for the Xiamen Lianxin Integrated Circuit Project. The products are stable, reliable, and come with a 3-year quality guarantee.
1.Here is the English translation of the provided text:
The following is a brief introduction by the Network Department for the Xiamen Lianxin Project:
Xiamen Lianxin Integrated Circuit Manufacturing Co., Ltd. (hereinafter referred to as Xiamen Lianxin) is a 12-inch wafer specialized enterprise jointly established by Taiwan United Microelectronics Corporation (hereinafter referred to as UMC), the Xiamen Municipal People’s Government, and Fujian Electronic Information Group. The total investment for the project amounts to USD 6.2 billion, and groundbreaking took place on March 26, 2015, with official operation and production commencing in November 2016.
Throughout its journey, Xiamen Lianxin has strictly adhered to the development strategy of its parent company, UMC, focusing on the research and development of chip feature processes. Its 28-nanometer process chips have received unanimous praise from the industry. Currently, Xiamen Lianxin can simultaneously provide 28-nanometer POLYSION and HKMG process technologies, with a yield rate exceeding 95%, making it the domestic 28-nanometer wafer plant with the highest yield.
In 2017, UMC made a significant decision to abandon the development of advanced processes such as 7nm, focusing on feature processes. Committed to providing customers with an innovative process platform and different technological directions beyond the mainstream market, Xiamen Lianxin aims to produce differentiated products to help customers break free from intense competition.
As a subsidiary of UMC, Xiamen Lianxin closely follows the development path of feature processes. In the independent research and development of advanced feature processes, Xiamen Lianxin’s General Manager personally leads a team of 141 senior researchers, currently developing the 28-nanometer high-voltage process, with plans to further complete the 22-nanometer high-voltage process. The 28-nanometer process has already undergone platform verification. Additionally, Xiamen Lianxin is conducting research and development on the 22-nanometer ultra-low power consumption process, the most advanced and unique process in the industry. It has already passed customer testing, with better power efficiency and enhanced radio frequency performance, providing a more optimized choice for IoT chips in digital TVs, monitors, wearable devices, and more.
Amid the current global pandemic, Xiamen Lianxin’s production capacity remains at 100% capacity. The current monthly production capacity has reached 20,000 pieces, expected to increase to 25,000 pieces after April 2021, seizing significant market opportunities. Xiamen Lianxin will further enhance the 28-nanometer production capacity ratio and conduct research and development on 28-nanometer and 22-nanometer feature processes to meet domestic market demand and achieve differentiated development.
Xiamen Lianxin Integrated Circuit Manufacturing (Xiamen) Co., Ltd. was registered on October 1, 2014, with the Xiamen Market Supervision Administration. Yau Chao-Sheng serves as the legal representative. The company’s business scope includes the production and research and development of 12-inch wafers and related products, as well as integrated circuit manufacturing.
2. 【Xiamen Lianxin Integrated Circuit Project】Rubber Joint Case Delivery Image：
3.Introduction to Shanghai Songjiang Shock Absorber Factory：
The above information is sourced from the official website of Shanghai Songjiang For more information on other electronic engineering cases, please visit the official website.
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